TSMC: Strategy for Subnanometer Transition and Globalization of Capacities

In 2026, the 3-nanometer process firmly established itself as TSMC's financial engine, accounting for a quarter of the company's revenue. This indicates complete market saturation with high-performance chips and a transition to a new microelectronics paradigm. The announced plan to launch the subnanometer A10 node by 2029 is not merely an engineering challenge but a strategic response to the deceleration of physical progress in lithography. The industry can no longer rely solely on transistor miniaturization; focus is now shifting toward packaging architecture, evidenced by the implementation of CoPoS technology, which enables direct component integration onto the substrate.

Global expansion of production capacity in the United States and Japan by 2028 reflects a complex geopolitical reality. TSMC must balance maximum efficiency of Taiwanese fabs with Western partners' localization requirements. This will inevitably raise the cost of end products but ensure resilience of global supply chains. The transition to A10 will become a critical test for the semiconductor industry. If the company achieves its goals, this will extend Moore's Law for several years, providing the necessary energy efficiency growth for data centers and artificial intelligence. However, any delays in mastering subnanometer technologies could lead to stagnation in computing power, delivering a systemic blow to the development of next-generation AI models and autonomous systems.